CMP Slurry

Description

AGC delivers slurry and polishing solutions that can be used for CMP processes, by making full use of the integrated production from raw material grain to slurry. To realize multi-layered structures with high levels of flatness, we optimize slurries that meet various applications, such as use for oxidized films and wiring materials.

Functions

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  Key Features
  • CMP Process 

CMP Process

 

 

 

 

 

 

 

  • CMP Slurry 

CMP Slurry

 

 

 

 

 

 

  • Wafer after CMP Processing 

wafer after CMP processing

Product range
  • Oxidized film polishing 

  • Copper wiring polishing

  • Poly-Si film polishing 

reference