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Home > Products > Electronics > Semiconductor Process and Materials > Through Glass Vias

Through Glass Vias

Glass substrate with through vias which enables 3D integration.

 

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Categories: Semiconductor Process and Materials, Electronics Tag: Black
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Description

AGC can make through vias in thin glass substrate by the patterns of customers’ requirements. AGC expects TGV substrate in the use of 3D integration for semiconductor packaging, and other wide variety of fields.

For the more connected world, we contribute to the miniaturization and acceleration of electronic devices through glass.

  • Miniaturization
    It enables micro wiring with excellent flatness, shape stability, and through fine via of the glass.
  • High speed
    It enables high speed and large capacity communication with excellent high frequency properties, through high insulation and low dielectric loss tangent of the glass.
  • High reliability
    It is best suited to the semiconductor packaging with non-alkali glass and coefficient of thermal expansion close to Si.
  • High productivity
    It can support a wafer, as well as a panel size.

 

AGC delivers an excellent function to everyone through the performance on the basis of proven technologies.

 

Basic specifications

Product Applications

  • Substrate for Semiconductor Packaging and Glass Interposer
  • 3D Glass IPD
  • MEMS, Sensor Device

TGV(European 3D TSV Summit)

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TGV(SEMICON TAIWAN)

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